Wolfspeed Module Portfolio
How to Serve the Entire Power Range
Compared with traditional silicon (Si) components, the performance of silicon carbide (SiC) technology has been comprehensively improved, including: lower power loss, faster switching speed, higher operating temperature, higher power density, higher overall efficiency.
Wolfspeed’s upgraded portfolio of power modules delivers the following benefits in industry-standard packaging: Configurations can serve a variety of applications, while packaging optimizations in industry-standard packaging and high-power modules provide better performance when compared to low-power, discrete-based applications bridges between the two, covering the entire power range.
The purpose of this article is to show how designers can reduce costs while increasing system efficiency and, more importantly, dramatically increasing overall system reliability.
Brief overview of the Wolfspeed product line
The Wolfspeed product portfolio covers a wide range of industries and applications requiring low to high power solutions, including electric vehicles (EVs), industrial power, grid infrastructure, solar and renewable energy, test equipment, uninterruptible power supplies (UPS) and other high power system. These include 1200 V and 1700 V SiC-based different packaged modules with multiple MOSFET topologies, Schottky and MOSFET body diode anti-parallel options, and early simulation for faster time-to-market. Figure 1 shows the product line along with some power ranges and applications.
You’ll find the Wolfspeed WolfPACK family of power modules in a spring-loaded baseplateless design (including crimp pins) for medium power applications, while the BM-, XM- and HM- baseplate modules are available in higher current ranges run. Regardless of the application, all modules are designed to achieve the same goals: maximize power density, simplify layout/assembly, enable scalable systems and platforms, minimize labor and system component costs, while providing the highest level of reliability.
Wolfspeed WolfPACK SiC Power Modules
The new Wolfspeed WolfPACK family of products (FM3/GM3) provides power in a substrateless, crimp interconnect housing. Available in two of the most common MOSFET configurations (currently six-tube integrated and half-bridge), this product family enables numerous power stages to benefit from the benefits of SiC. These modules also provide higher power density and lower weight system components. Overall, Wolfspeed WolfPACK modules help reduce overall size and complexity while reducing system and maintenance costs. Wolfspeed WolfPACK modules provide designers with a reliable mid-power range solution that can be scaled appropriately for seamless system upgrades when necessary.
Wolfspeed WolfPACK housings use metal mounting tabs as a spring interface and feature heat sinks to optimize thermal management performance and provide uniform pressure at thermal junctions. Upon closer inspection, its ceramic direct-copper substrate enhances heat sink electrical isolation and enables lower thermal resistance, resulting in better thermal performance at higher ampacities. Wolfspeed WolfPACKs are also equipped with crimp pins that provide high reliability and excellent electrical and mechanical properties due to tight compression when inserted into a plated PCB. With pin arrays corresponding to the internal MOSFET arrangement, designers can achieve simple unidirectional mounting in industry standard package sizes. If the application requires multiple modules, the internal PCB mounting method also provides the option to connect multiple modules together for high power requirements. Figure 2 shows the FM3 and GM3 WolfPACK modules.
Wolfspeed BM industry standard 62 mm module
Wolfspeed’s industry-standard 62 mm SiC modules enable the industry’s broadest portfolio of high-power solutions, designed to meet a variety of requirements, enabling unprecedented system power and efficiency. Designers can now replace 62 mm IGBTs with Wolfspeed 62 mm BM modules with SiC technology, helping to reduce cooling requirements, system cost, power losses and system inductance while optimizing voltage utilization.
The BM 62 mm series modules are available in 1.2 kV and 1.7 kV half-bridge topologies and can deliver up to 530 A. Materials for these modules can be selected for different operating conditions, for example, Wolfspeed offers THB-80 compliant housing material options for increased robustness in harsh environment applications.
The BM series modules (see Figure 3) feature screw terminals, utilizing laminated busbars or PCB and copper substrates for secure connections to high power systems, maximizing thermal conductivity and mechanical strength. In addition, the screw terminals feature 5 kV isolation creepage and clearance to support 1.7 kV active devices. All devices are housed in an industry-standard 62 mm package for easy system upgrades and drop-in replacements for 200 kW+.
Some of the applications supported by these modules include off-board charging and electric vehicle fast charging systems, rail and traction applications, industrial test equipment, and industrial motor drives. The Wolfspeed BM family of products is easy to use and upgradeable with SiC technology, offering many benefits including improved power efficiency, power density, switching frequency and overall improved robustness and reliability.
Wolfspeed XM3 and HM3 Platforms
Wolfspeed WolfPACK and BM series products are available in industry standard packages, while XM3 and HM3 modules are included in the broader Wolfspeed product portfolio, helping designers take full advantage of the benefits of enclosure customization.
The XM3 half-bridge module (top view, shown in Figure 4) is 50% smaller and 50% lighter than the 62 mm industry standard size. Other features include conduction and switching loss optimization, low inductance bus interconnects, integrated temperature sensing, built-in voltage sensing, and a high-reliability power substrate with enhanced power cycling capabilities. The housing is modular, expandable and reconfigurable with an inductance as low as 6.5 nH.
Compared to similar power modules such as SemiTrans 3 or EconoDual with similar voltage and current ratings (up to 450 A at 1200 V), the XM3 module offers designers the option not only to be 50% smaller, but also 50% smaller parasitic inductance, but also reduce overall switching losses. In addition, XM3-based inverters (such as the 300 kW CRD300DA12E-XM3 and 600 kW CRD600DA12E-XM3 devices) offer advantages in weight (up to 50% reduction) and volumetric power density (up to 20 times) compared to conventional Si inverters Significant improvements have been made in all aspects.
The HM3 family of products offers Wolfspeed’s highest power density power modules available. Using a lightweight aluminum silicon carbide (AlSiC) substrate, a compact size that supports high current (< 800 A) and high frequency low inductance, the HM3 delivers unprecedented power density in a size optimized for SiC technology. The device is available in two voltage options including a 1200 V half bridge at 481 A (with Schottky diode) and 765 A, and a 1700 V half bridge at 380 A (with Schottky diode) and 650 A.
The housing of the HM3 module (shown in Figure 5) contains 62 mm studs compatible with SiC and SiN substrates for robust thermomechanical performance, and a terminal design with 4.9 nH inductance for high power stacking Layer bus connection. The interface pins have creepage and clearance to support 1.7 kV devices. Internally, the device has a gate and Kelvin resistor network, allowing 12 devices to be connected in parallel for each switch position. In addition, the module features the gate driver reference design CGD1700HB3P-HM3 for fast start-up, basic protection and detection. To further reduce the operating temperature of the module, liquid-cooled cold plate heat sinks such as the CP3009-XP from Wieland Microcool can be used.
Additional benefits and resources provide designers with confidence,
Accelerate time to market
Wolfspeed power modules are optimized to provide best-in-class SiC performance packages to meet each customer’s unique system requirements. In addition, we offer two different products that serve different value propositions for our customer base: industry standard packages and optimized packages.
Industry standard dimensions are carefully engineered dimensions/packages that have been internally optimized for SiC, providing a package-level drop-in replacement for customers using Si-based or SiC-based device platforms. On the other hand, an optimized package developed by Wolfspeed helps provide enhanced functionality for modules designed with SiC technology.
Wolfspeed has released evaluation gate driver boards for every packaging platform to help designers improve lab efficiency. In addition, Wolfspeed offers other evaluation kits and reference designs (such as inverters, power converters, chargers, etc.) to speed time to market.
Reference designs come with application notes, user guides, and design files, allowing designers to create robust and reliable systems with outstanding power density, performance, and efficiency. It’s worth noting here: Wolfspeed has partnered with brands that have been specifically tested and integrated into evaluation and reference designs, providing designers with complete pictures and documented data for reference at all stages of development.
Finally, Wolfspeed SpeedFit 2.0 design simulation software further improves the SiC design process by helping to select the right Wolfspeed product. It can be used to run simulations, easily predict and minimize conduction and switching losses, quickly compare different devices and thermal configurations, and generate circuit block diagrams and summary reports to help you bring your entire project together.
Product Portfolio Covering All Needs
In recent years, Wolfspeed’s modular product portfolio has seen a series of major upgrades. Today, it covers the entire power range, from low to high power. Because all of these modules feature Wolfspeed’s industry-leading SiC technology, designers can either upgrade existing modules and enjoy the benefits of a SiC solution, or start new designs with smaller, lighter, more powerful sub-modules System Components.
In fact, today’s system designers can take advantage of the key benefits of this portfolio, not only with options across the entire power range, but also with Wolfspeed reference designs, supporting hardware, and simulation and CAD programs. In addition, Wolfspeed offers dedicated SiC system and circuit design experts and exclusive ecosystem partnerships to give designers the support and flexibility they need, eliminate risk, and help reduce time-to-market.