Market demands for smaller, denser semiconductor chips are forcing manufacturers to produce semiconductor devices that push the limits of existing capabilities, while requiring precision engineering for reliable results. “In electronics, cost-effectiveness is a key factor when it comes to materials and thermal management,” Steve Amos, senior specialist in 3M’s Advanced Materials Division, told Power Electronics News. “It’s not as simple as just looking at material cost. It’s looking at material utilization, how much to use, and how its performance versus cost. For example, while some advanced materials are more expensive, their properties allow the use of less volume or mass. .I think ceramic fiber versus glass fiber, boron nitride versus graphite, or glass bubbles versus solid silica. A cost benefit analysis is needed to make the best choice, not just price tags. “
The reliability and durability of electrical and electronic components are affected by temperature. Temperature issues are often the cause of gadget failure. Elevated circuit temperatures can cause premature aging of equipment, while low temperatures can promote condensation formation that can damage electronics and lead to corrosion. Power and high temperature are inseparable. In each system, a small fraction of the power is converted into unused heat. This is the case with power circuits, inverters, converters, choppers, and power supplies that generate a lot of heat, especially if they are poorly designed.
If the power devices follow good construction standards, comply with regulations, adhere to operational constraints, employ fast switching elements, and have minimal heat dissipation, the system will operate at lower temperatures with higher efficiency. Efficiency loss is one of the most serious consequences of high temperature in a circuit. Integrated circuits and electronic components are often damaged by high temperatures. High temperatures not only make the system unsafe, but it can also shorten the average lifespan of components, causing them to deteriorate.
thermal management
Proper thermal management of electronic components and circuits is an essential requirement to ensure the correct functioning and reliability of the system under all operating conditions. The current trend towards the gradual miniaturization of electronic devices and the increasing demand for power density have brought thermal management issues to the forefront, especially for the latest generation of power devices.
“At the system level, miniaturization and substantial reduction in device mass are already under consideration,” Amos said. “Less thermal mass should make thermal management easier.”
Additionally, according to Amos, some of the biggest challenges affecting the electronics industry today revolve around supply chains and material availability: “We’ve seen increased demand and supply disruptions in supply chains that are less flexible. I would encourage OEMs to consider New sources of supply, more regional and qualified alternative materials, they may already be in the pipeline but there is no reason to pursue further.”
The 5G and high-power markets do drive different substrate and material considerations because they are addressing different challenges. “5G is dealing with cost-effective low-loss materials, and high power is dealing with thermal management,” Amos said. “3M is excited to help customers meet these challenging material needs.”
Thermal analysis of electrical equipment is an essential step to ensure system stability and is even more important for miniaturized and high-performance equipment. Thermal analysis generally calculates a range of operating conditions and heat transfer between parts. Designers studied hot air paths to avoid air bubbles forming in the circuit. Heat can be dissipated by forced and natural convection from fans. The functionality of the electronic energy conversion circuit depends on the designer’s calculations. One of the biggest challenges facing electronics designers is reproducing or simulating the harshest operating conditions, where electronic equipment is subjected to high thermal stress.